Buga kewaye hukumar: description, nadi

A buga kewaye jirgin ne tsarin kashi cewa ya hada da wani dielectric tushe da kuma jan conductors, wanda aka ajiye a kan wani substrate a cikin nau'i na metallized sassan. Yana bayar da wani fili na wutan lantarki abubuwa.

A kewaye hukumar tana da yawan abũbuwan amfãni idan aka kwatanta da girma (hinged) shigarwa ta amfani da igiyoyi, da wayoyi:

• High yawa hawa na rediyo aka gyara da kuma su mahadi, sakamakon rage muhimmanci size da kuma nauyi.
• samun conductors kuma da tsare saman, da kuma rediyoaktif abubuwa a guda fasaha sake zagayowar.
• kwanciyar hankali, repeatability halaye kamar capacitance, conductance, inductance.
• high gudun da amo rigakafi circuitry.
• jure inji da yanayin da tasirinsa.
• standardization da kuma daidaituwa na fasaha da zane mafita.
• AMINCI majalisai, raka'a da na'urar a matsayin dukan.
• inganta processability a sakamakon hadadden aiki da kai na taron yadda ake gudanar, iko da kuma gyara ayyukan;
• low aiki tsanani, kayan amfani kuma halin kaka.

A buga kewaye hukumar ma yana da drawbacks, amma su ne quite a bit: iyakance maintainability kuma high haduwar kara zane canje-canje.

The abubuwa irin katunan hada da wani dielectric tushe, wani ƙarfe shafi, wanda shi ne mai juna daga buga conductors, contact gammaye. kayyade da kuma hawa ramukan.

Bukatun da shafi wadannan kayayyakin Gost

• Buga kewaye hukumar kamata a yi kama launi a dielectric substrate ya zama monolithic a tsarin, ba dauke da ciki vesicles, sinks, kasashen waje inclusions, fasa, kwakwalwan kwamfuta, daure. Duk da haka a yarda guda scratches, karfe inclusions, kau na burbushi neprotravlennogo guda rabo da kuma nuni na tsarin wanda ba ya canza lantarki sigogi na samfurin, ba rage canja nesa tsakanin juna abubuwa.
• Figure - bayyanannu, tare da m baki, babu blisters, fasa, peeling, da alama kayan aiki. Kadan gida stains, amma ba fiye da maki biyar da square decimeter, tare da proviso cewa sauran waƙar nisa zai dace da mafi ƙarancin canja. crack tsawon zuwa shida millimeters da kuma zurfin 25 microns.

Don inganta lalata yi da kuma inganta solderability hukumar surface rufi da electrolytic abun da ke ciki wanda ya zama m, ba tare da peeling, karya da kuma podgarov. Kayyade da kuma hawa ramuka dole a zubar daidai da zane. A yarda a yi karkacewa a tsare daidaito aji fee. Domin inganta AMINCI soldering a kan dukkan ciki saman na hawa ramuka fesa jan Layer, wanda kauri ya zama kasa da 25 microns. Wannan tsari shine ake kira - metallization na ramukan.

Mene ne PCB azuzuwan? A karkashin wannan ra'ayi yakan haifar da azuzuwan daidaici masana'antu allon kayan wutan, suna bayar da Gost 23751-86. Dangane da juna yawa daga cikin buga kewaye hukumar yana da biyar azuzuwan na daidaito, da zabi na abin da aka ƙaddara da fasaha kayan aiki da sha'anin matakin. A farko da na biyu azuzuwan ba ya bukatar daidaici kayan aiki da kuma suna dauke cheap, don samar. A hudu da na biyar azuzuwan bukatar musamman kayan, musamman kayan aiki, m m, a samar da wurin, kwandishan, yawan zafin jiki kula. Domestic Enterprises taro samar buga kewaye allon na uku aji na daidaito.